Polysaccharide Microencapsulation Patented Technology
Polysaccharide Microencapsulation Patented Technology
Leveraging its proprietary microencapsulation patented technology, JoyCom integrates polysaccharides with oligopeptides, enabling these two critical wound-healing factors to act synergistically and promote active wound healing.
This technology stimulates the production of type I collagen and granulation tissue, accelerating wound contraction and epithelial regeneration. As a result, healed tissue is restored with normal hair follicle structures, while the formation of scars and post-inflammatory hyperpigmentation is effectively minimized.
Clinically applied in surgical wounds, burns, and skin graft procedures, this technology has demonstrated outstanding performance and has been widely recognized and adopted by leading medical institutions. Notably, among post-cesarean section wound dressings, it holds a dominant market share, ranking No. 1 in the active wound dressing segment.
This technology stimulates the production of type I collagen and granulation tissue, accelerating wound contraction and epithelial regeneration. As a result, healed tissue is restored with normal hair follicle structures, while the formation of scars and post-inflammatory hyperpigmentation is effectively minimized.
Clinically applied in surgical wounds, burns, and skin graft procedures, this technology has demonstrated outstanding performance and has been widely recognized and adopted by leading medical institutions. Notably, among post-cesarean section wound dressings, it holds a dominant market share, ranking No. 1 in the active wound dressing segment.